Issue:

PLUMEE, Number 1, Volume I

Section:

Issue No. 1 - Volume 3(2013)
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Abstract:

After an introductory part about packaging in microtechnologies, the reliability issues of epoxy materials used in microtechnologies are described. The two main applications of epoxy materials in packaging of active electronic components, as moulding material and adhesive, respectively, are covered. In each case, the most appropriate reliability tests are described, including accelerated tests with environmental factors such as temperature, humidity, etc. Also, typical failure mechanisms are detailed. The rubber modified epoxy is presented as the current solution for toughening the epoxy resin.

Keywords:

epoxy resins, microtechnologies, reliability, tests, failure mechanisms.

Code [ID]:

PLUMEE201301V01S01A0008 [0003964]

Full paper:

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