The present paper refers to the manufacture of some planar metal-ceramic non magnetic micropackages for microwave application. The microwave semiconductor components mounted in planar metal-ceramic non magnetic micropackages were used on a large scale because of the advantages they have such as their own capacitances and inductances (fraction of pF and nH respectively), reduced microwave losses, very small dimensions, mechanical robustness and environment attack resistance. By the technological route the same planar metal-ceramic non magnetic micropackages have been manufactured through an original technology, direct joining by the metal-metal diffusion method.
