The paper comparatively presents planar micropackages for mounting microwave devices manufactured by two technological routes(the classical technology and the gold-gold diffusion method) , using technological processes specific to electronic microtechnologies. By using technological processes specific to electronic micro technologies (metallic thin film deposition, masking, photolithography photoresist mask etching) ceramic structures with a certain metallization configuration and an exceptional dimensional precision, dimensional tolerance being of the order of microns, are obtained. [1]
