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PACKAGING OPTIMIZATION OF AND ELECTO-OPTICAL MODULATOR FOR HIGH DATA-RATE COMMUNICATIONS

SAMUEL NGOHO 1, KAMEL FRIGUI 1, STÉPHANE BILA 1, BOUCHRA FRIGUI 2, DELPHINE MARRIS-MORINI 3, LAURENT VIVIEN 3, ALEXANDRE MOTTET 4, JÉRĂ”ME HAUDEN 4, STÉPHANE BERNABE 5, BENJAMIN BLAMPLEY 5, GABRIEL CHARLET 6
1. XLIM UMR 7252, Université de Limoges/CNRS, 123 Av. Thomas, 87060 Limoges, France
2. CISTEME, Technopole ESTER, 12 Rue GĂ©mini, 87060 Limoges, France
3. IEF UMR 8622, Univ.Paris-Sud/CNRS, Rue Ampère, 91405 Orsay, France
4. PhotLine Technologies, 16 Rue Jouchoux, 25000 Besançon, France
5. CEA leti MINATEC Campus, 17 rue des martyrs, F-38054 Grenoble Cedex, France
6. ALCATEL-LUCENT Bell Labs, Centre de Villarceaux Route de Villejust, 91620 Nozay, France

Issue:

PLUMEE, Number 1, Volume V

Section:

Issue No.1 - Volume 5 (2015)

Abstract:

This paper presents a measured electro-otpical silicon modulator based on carrier depletion in a PN junction and electromagnetics simulations for optimizing its behavior. It also reports on the packaging of the modulator, specifically, both the input and output circuits which allow connecting in one hand the driver and then the load for RF matching.

Keywords:

Packaging, electro-optical modulator, multiphysical modeling, PN junction on silicon.

Code [ID]:

PLUMEE201501V05S01A0017 [0004256]

Full paper:

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