PACKAGING OPTIMIZATION OF AND ELECTO-OPTICAL MODULATOR FOR HIGH DATA-RATE COMMUNICATIONS

  • SAMUEL NGOHO
    XLIM UMR 7252, Université de Limoges/CNRS, 123 Av. Thomas, 87060 Limoges, France
  • KAMEL FRIGUI
    XLIM UMR 7252, Université de Limoges/CNRS, 123 Av. Thomas, 87060 Limoges, France
  • STÉPHANE BILA
    XLIM UMR 7252, Université de Limoges/CNRS, 123 Av. Thomas, 87060 Limoges, France
  • BOUCHRA FRIGUI
    CISTEME, Technopole ESTER, 12 Rue Gémini, 87060 Limoges, France
  • DELPHINE MARRIS-MORINI
    IEF UMR 8622, Univ.Paris-Sud/CNRS, Rue Ampère, 91405 Orsay, France
  • LAURENT VIVIEN
    IEF UMR 8622, Univ.Paris-Sud/CNRS, Rue Ampère, 91405 Orsay, France
  • ALEXANDRE MOTTET
    PhotLine Technologies, 16 Rue Jouchoux, 25000 Besançon, France
  • JÉRÔME HAUDEN
    PhotLine Technologies, 16 Rue Jouchoux, 25000 Besançon, France
  • STÉPHANE BERNABE
    CEA leti MINATEC Campus, 17 rue des martyrs, F-38054 Grenoble Cedex, France
  • BENJAMIN BLAMPLEY
    CEA leti MINATEC Campus, 17 rue des martyrs, F-38054 Grenoble Cedex, France
  • GABRIEL CHARLET
    ALCATEL-LUCENT Bell Labs, Centre de Villarceaux Route de Villejust, 91620 Nozay, France

Abstract

This paper presents a measured electro-otpical silicon modulator based on carrier depletion in a PN junction and electromagnetics simulations for optimizing its behavior. It also reports on the packaging of the modulator, specifically, both the input and output circuits which allow connecting in one hand the driver and then the load for RF matching.

Cuvinte cheie

Packaging electro-optical modulator multiphysical modeling PN junction on silicon.